Rigid Flexible PCB capability
| | |
| product type | FR-4, High Tg, Aluminium, Copper PCB, Ceramic PCB, Polyimide PCB, Rigid-flex PCB |
| Max layer count | 20 layers |
Min base copper thickness | 1/3 OZ (12um) |
| Max finished copper thickness | 10 OZ (350um) |
| Min trace width/spacing(Inner layer) | 2/2mil (0.05mm) |
| Min trace width/spacing(Outer layer) | 2/2mil (0.05mm) |
| Min spacing between hole to inner layer conductor | 6mil (0.15mm) |
| Min spacing between hole to outer layer conductor | 6mil (0.15mm) |
| Min annular ring for via | 4mil (0.1mm) |
| Min annular ring for component hole | 4mil (0.1mm) |
| Min BGA diameter | 4mil (0.1mm) |
| Min BGA pitch | 4mil (0.1mm) |
| Min hole size | 0.15mm(CNC); 0.1mm(Laser) |
| Max aspect ratios | 8.01 |
| Min soldermask bridge width | 4mil (0.1mm) |
| Soldermask/circuit processing method | Film |
| Min thickness for insulating layer | 1mil (0.025mm) |
| HDI & special type PCB | HDI(1-3 steps), R-FPC(2-16 layers), High frequency mix-pressing(2-14 layers), Buried capacitance & resistance, 0.14mm to 0.2mm
extra thinner pcb,high heat conducting thermoelectric separation copper based pcb, etc |
| Surface treatment type | ENIG, HAL, HAL lead free, OSP, Immersion Sn, mmersion silver, Plating hard gold,Plating silver, carbon oil, ENIG immersion tin
plating |
| Max PCB size | Multi-layer: 600*550mm 1-2 layer: 500*1200MM |
Rigid-flex PCBs provide the best benefits of rigid and flex PCBs in one solution. Applications where rigid flex PCBs excel are:
1. High-reliability applications. If an assembly will be exposed to excessive or repeated shock, or high vibration environments, connectors with flexible cables are more likely to fail. Rigid flex PCBs provide great reliability even when subjected to extreme vibration and shock applications.
2. High-density applications. Within a small enclosure, it’s sometimes impossible to accommodate all of the cables and connectors that an electronic PCB design would require. Rigid flex boards can fold into very small, and very thin profiles, offering substantial space savings in these instances.
3. Five or more rigid boards. If your application will ultimately involve five or more rigid boards connected to one another with flex cables, an integrated rigid flex solution is often the optimal and most cost-effective choice.
Rigid-flex PCBs are a means to streamline the electronic design, by eliminating flexible cables, connectors and discrete wiring. The electrical performance of a rigid flex PCB is enhanced compared to its counterparts, because the circuits are integral to the overall construction. All of the electrical and mechanical connections are internally contained within the rigid-flex PCB, providing the electronics designer with much improved service reliability and electrical performance.
Our boards manufactured are wildly used on many industries, such as Industrial control, MCU control , Smart Home , Tele-communication , Automobile ,Programming control, Wireless ,Medical ,LED control and Consumer Electronics.
YDY with great experience in EMS manufacturing and management
Shenzhen Yideyi Technology Co., Ltd is a manufacturer specializing in the research & development, manufacture and marketing of PCB boards. We have had about 300 workers. Our company was established in Shenzhen City of Guangdong Province in 2008. Covering an area of 2400 square meters, our workshops are equipped with about 60 binding machines.
FAQ:
Q1. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.
Q2. What kind of PCB file format can you accept for production?
Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)
Q3. What’s the MOQ?
We are able to handle Small as well as large volume production with flexibility.
Q4. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.
Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.
Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
